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Investigation of aluminum patterned electrodeposition process from AlCl3-[EMIm]Cl ionic liquid for microsystems application

 
: Farisi, M.S.A.; Hertel, S.; Wiemer, M.; Otto, T.

:

Institute of Electrical and Electronics Engineers -IEEE-; International Microelectronics and Packaging Society -IMAPS-:
International Conference on Electronics Packaging and IMAPS All Asia Conference, ICEP-IAAC 2018 : Hotel Hanamizuki, Kuwana, Mie, Japan, April 17 (Tue)-21 (Sat), 2018
Piscataway, NJ: IEEE, 2018
ISBN: 978-4-9902-1885-0
ISBN: 978-4-9902-1884-3
ISBN: 978-1-5386-4864-3
S.415-418
International Conference on Electronics Packaging (ICEP) <2018, Kuwana/Japan>
International Microelectronics and Packaging Society (IMAPS All Asia Conference IAAC) <2018, Kuwana/Japan>
Englisch
Konferenzbeitrag
Fraunhofer ENAS ()

Abstract
Aluminum electro-chemical-deposition (ECD) from ionic liquid has become an attracting deposition method. To extend the utilization of the film, in particular for microsystem applications, a microstructure formation by patterned ECD of Al from AlCl 3 -1-ethyl-3-methylimidazolium chloride ([EMIm]Cl) ionic liquid is investigated in this study. The influences of each deposition parameters to the ECD process as well as the resulting surface morphology are evaluated. It is also found that a recurrent galvanic pulse plating process yields in a higher current efficiency.

: http://publica.fraunhofer.de/dokumente/N-520333.html