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Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density

 
: Böttge, B.; Naumann, F.; Behrendt, S.; Scheibel, M.G.; Kässner, S.; Klengel, S.; Petzold, M.; Nickel, K.G.; Hejtmann, G.; Miric, A.-Z.; Eisele, R.

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Karikalan, S. ; Institute of Electrical and Electronics Engineers -IEEE-:
68th Electronic Components and Technology Conference, ECTC 2018. Proceedings : 29 May-1 June 2018, San Diego, California
Piscataway, NJ: IEEE, 2018
ISBN: 978-1-5386-5000-4
ISBN: 978-1-5386-4999-2
ISBN: 978-1-5386-4998-5
S.1258-1269
Electronic Components and Technology Conference (ECTC) <68, 2018, San Diego/Calif.>
Englisch
Konferenzbeitrag
Fraunhofer IMWS ()

Abstract
The paper introduces novel phosphate cement- and calcium aluminate cement-based material systems with enhanced thermal, mechanical and thermomechanical properties for the encapsulation of power electronic devices and modules. These materials are aiming at improving the high-temperature operation potential of power electronic systems and thus, to promote a successful application of wide bandgap power devices in power electronics. The main focus of the study consists in a thorough material characterization of the novel cement-based encapsulants including high resolution microstructural analysis combined with a modelling approach to support material design optimization. A second task consists in the analysis of interactions of the encapsulants with the electronic material interfaces, e.g. the top-side metallization of power semiconductors, substrate metallizations and bonding wires. Furthermore, power cycling tests coupled with a comprehensive failure analysis have been carried out comparing IGBT power modules with standard silicone gel encapsulation and cement-based encapsulation. The results highlight the potential of the novel cement-based encapsulants on reliability improvements at high-temperature operation.

: http://publica.fraunhofer.de/dokumente/N-520226.html