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Thin Glass Based Optical Sub-Assemblies for Embedding in Electronic Systems

 
: Lewoczko-Adamczyk, W.; Böttger, G.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D.

:

Karikalan, S. ; Institute of Electrical and Electronics Engineers -IEEE-:
68th Electronic Components and Technology Conference, ECTC 2018. Proceedings : 29 May-1 June 2018, San Diego, California
Piscataway, NJ: IEEE, 2018
ISBN: 978-1-5386-5000-4
ISBN: 978-1-5386-4999-2
ISBN: 978-1-5386-4998-5
S.1136-1139
Electronic Components and Technology Conference (ECTC) <68, 2018, San Diego/Calif.>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

Abstract
In this article we propose integration of optics and electronics using thin panel glass. Several interfacing and integration levels of optical sub-assemblies in electronic systems realized in exemplary system assemblies or suggested conceptually will be described. They consist of proven or currently developed system components and assembly processes on panel level production machinery. Laser-cutting of panel glass enables for fast manufacturing of optical components with on-demand extensions, with complex beam paths and high stability as required e.g. in optical interferometers. Solutions are presented, demonstrating industrial thin glass parts processed from large glass panels to be a very versatile and efficient development and rapid-production platform.

: http://publica.fraunhofer.de/dokumente/N-520224.html