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Challenges and Progress on Carbon Nanotube Integration for BEOL Interconnects

: Uhlig, B.; Dhavamani, A.; Nagy, N.; Lilienthal, K.; Liske, R.; Ramos, R.; Dijon, J.; Okuno, H.; Kalita, D.; Lee, J.; Georgiev, V.; Asenov, A.; Amoroso, S.; Wang, L.; Koenemann, F.; Gotsmann, B.; Goncalves, G.; Chen, B.; Liang, J.; Pandey, R.R.; Chen, R.; Todri-Sanial, A.


Institute of Electrical and Electronics Engineers -IEEE-:
IEEE International Interconnect Technology Conference, IITC 2018 : 4-7 June 2018
Piscataway, NJ: IEEE, 2018
ISBN: 978-1-5386-4337-2
ISBN: 978-1-5386-4336-5
ISBN: 978-1-5386-4338-9
International Interconnect Technology Conference (IITC) <2018, Santa Clara/Calif.>
Fraunhofer IPMS ()

Here, we review and present current challenges and progress on Carbon Nanotube Integration for BEOL Interconnects as well as our recent results. Amongst all the research on carbon nanotube interconnects, those discussed here cover 1) improvement of the variability of SWCNTs for local interconnects 2) process & growth of carbon nanotube interconnects compatible with BEOL integration and formation of CNT-copper-composites, 3) modeling and simulation from atomistic to circuit-level benchmarking and performance prediction, and 4) characterization and electrical measurements. The aim is to evaluate the use of CNT-based materials for future metallization, both in regards to manufacturability, i.e. CMOS compatibility and wafer-scale integration as well as realistic performance expectations, i.e. variability and defectivity.