PublicaHier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
Ambient pressure plasma activation for low temperature bonding
|Bagdahn, J. ; University of Technology of Delft:|
2nd International Workshop on Wafer Bonding for MEMS Technologies 2006 : 9th-11th April 2006, Halle/Saale, Tagungsband
|International Workshop on Wafer Bonding for MEMS Technologies <2, 2006, Halle/Saale>|
|Fraunhofer IST ()|
Compared to low pressure plasma and wet chemical treatments, respectively, the activation wuth dielectric barrier discharge (DBD) is very fast, cost efficient and environmentally firendly. This paper presents several pre-treatments for low temperature wafer bonding using DBDs at atmospheric pressure. Advantages and disadvantages of these techniques will be pointed out.