Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

3D integration processes for advanced sensor systems and high-performance RF components

: Weber, Josef; Fernandez-Bolanos, Montserrat; Ionescu, Adrian; Ramm, Peter

Postprint urn:nbn:de:0011-n-5153972 (616 KByte PDF)
MD5 Fingerprint: a3d42d3d1d03dbc3954ad4faff210bf6
Erstellt am: 26.10.2018

Dow, W.-P. ; Electrochemical Society -ECS-; Electrochemical Society -ECS-, Electronics and Photonics Division; Electrochemical Society -ECS-, Dielectric Science and Technology Division:
Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB : Held during the AiMES 2018, ECS and SMEQ Joint International Meeting, in Cancun, Mexico, from September 30 - October 4, 2018
Pennington, NJ: ECS, 2018 (ECS transactions 86.2018, Nr.8)
ISBN: 978-1-5108-7168-7
ISBN: 978-1-62332-541-1
ISBN: 978-1-62332-542-8
ISBN: 978-1-60768-854-9
Symposium "Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB" <2018, Cancun>
Americas International Meeting on Electrochemistry and Solid State Science (AIMES) <2018, Cancun>
Electrochemical Society (ECS Meeting) <234, 2018, Cancún>
Sociedad Mexicana de Electroquímica (SMEQ Congreso) <33, 2018, Cancun>
European Commission EC
FP7-ICT; 257488; e-BRAINS
Best-Reliable Ambient Intelligent Nano Sensor Systems
Konferenzbeitrag, Elektronische Publikation
Fraunhofer EMFT ()
3D integration; heterogeneous integration; TSV; wafer bonding; sensor; IoT; antenna; inductor

Sensor systems are the key elements of todays automotive, health care, environmental and Internet-of-Things (IoT) applications. By using MEMS sensors data like physical or electrical parameters in production equipment, gas concentration in the environment or chemical parameters in fluids can be recorded, digitized and transferred for further processing e.g. by means of big data algorithms in a server or cloud environment. For realizing such systems advanced sensors, which are in many cases based on sophisticated nano-technologies have to be combined with standard CMOS devices, which digitize the analogue sensor signals and optimize the overall data acquisition and data transmission. 3D integration processes are most suitable for high performant and reliable integration of sensor functions and electronic processing and simultaneously minimize the footprint, weight and form-factor of the sensor/IC product. 3D integration processes as fine-pitch Trough-Silicon-Vias (TSV) technology and various wafer bond technologies will be introduced in this paper.