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Embedding electronics into additive manufactured components using laser metal deposition and selective laser melting

 
: Petrat, Torsten; Kersting, Robert; Graf, Benjamin; Rethmeier, Michael

:
Volltext urn:nbn:de:0011-n-5152336 (627 KByte PDF)
MD5 Fingerprint: 19e743de7893aab867b5b7eddb97188c
(CC) by-nc-nd
Erstellt am: 18.10.2018


Procedia CIRP 74 (2018), S.168-171
ISSN: 2212-8271
International Conference on Photonic Technologies <10, 2018, Fürth>
Englisch
Zeitschriftenaufsatz, Konferenzbeitrag, Elektronische Publikation
Fraunhofer IPK ()
additive manufacturing; condition monitoring; process chain; laser metal deposition; Selektive Laser Melting; embedded electronic

Abstract
The paper deals with the integration of a light emitting diode (LED) into an additive manufactured metal component. Selective laser melting (SLM) and laser metal deposition (LMD) are used. The material used is the chrome-nickel steel 316L. The basic component is manufactured by means of SLM and consists of a solid body and an area with grid structure. The solid body includes a duct in the shape of a groove with a recess for the positioning of the power cable. The LED is embedded in the grid structure via an inlet from the solid body. In further processing, the groove is filled with LMD. Two strategies with different parameter combinations were investigated. It shows that a high energy input near the power cable leads to its destruction. By using multiple parameter combinations during the manufacturing process, this destruction can be prevented. There was a comparison of both strategies with regard to the necessary number of tracks and duration of welding time.

: http://publica.fraunhofer.de/dokumente/N-515233.html