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Hot embossing of glass and metal

 
: Schubert, A.; Rau, B.; Burkhardt, T.; Borck, J.

Semiconductor Equipment and Materials International -SEMI- Japan:
8th SEMI Microsystem/MEMS Seminar 2004 : 02.12.2004, Tokio
Tokio, 2004
S.181 ff.
Microsystem/MEMS Seminar <8, 2004, Tokio>
Englisch
Konferenzbeitrag
Fraunhofer IWU ()
hot embossing; glass; metal; microsystem technology; replication technology; microstructure; microfluidic structure; embossing equipment

Abstract
Metals and Glass are widely used materials in several fields of application in microsystems technology. Also in medical applications for analysis and in information technology for optical applications these materials are of interest. For a broader use also in miniaturized systems the availability of microstructure replication technology is necessary. In the paper the possibility of embossing fluoride glass with high accuracy in glass sheets is shown. Microfluidic structures and also support structures for light wave guides were made by embossing. Also the embossing of aluminium alloys with small structures is possible and will be shown. These results were achieved with an embossing equipment for wafer diameter of 50 mm. Dedicated to this embossing technology an newly machine system was developed. This embossing equipment allows the hot embossing of sheets up to an diameter of 100 mm and up to temperatures of 700° C.

: http://publica.fraunhofer.de/dokumente/N-50948.html