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Novel mask-less plating metallization route for bifacial silicon heterojunction solar cells

 
: Hatt, Thibaud; Mehta, Vivek Pankaj; Bartsch, Jonas; Kluska, Sven; Jahn, Mike; Borchert, Dietmar; Glatthaar, Markus

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Postprint urn:nbn:de:0011-n-5074107 (2.1 MByte PDF)
MD5 Fingerprint: 32de3db81046cacb95a72a5b1de8a13a
Copyright AIP
Erstellt am: 8.9.2018


Ballif, C. ; American Institute of Physics -AIP-, New York:
SiliconPV 2018, 8th International Conference on Crystalline Silicon Photovoltaics : 19-21 March 2018, Lausanne, Switzerland
Woodbury, N.Y.: AIP, 2018 (AIP Conference Proceedings 1999)
ISBN: 978-0-7354-1715-1
Art. 040009, 7 S.
International Conference on Crystalline Silicon Photovoltaics (SiliconPV) <8, 2018, Lausanne>
European Commission EC
H2020-Low-cost, low-carbon energy supply - Developing the next generation technologies of renewable electricity and heating/cooling; 727529; DISC
Double side contacted cells with innovative carrier-selective contacts
Englisch
Konferenzbeitrag, Elektronische Publikation
Fraunhofer ISE ()

Abstract
The proof of concept of a novel metallization route for bifacial silicon heterojunction (SHJ) solar cells by selective plating – i.e. organic mask-free, is demonstrated by a first lab scale solar cell (η=15.5%). A patterned metal-seed is inkjet-printed or deposited by PVD on a PVD-Al layer covering the ITO layer. The copper electroplating process is investigated considering different electrolytes and plating settings in order to selectively cover the metal-seed and not the PVD Al layer. As well a processing chemistry to etch the PVD-Al layer without affecting the ITO and the electroplated contact is presented.

: http://publica.fraunhofer.de/dokumente/N-507410.html