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Roughness measurements of Al and Cu particles in Laser-Induced forward transferring process

: Azhdast, M.H.; Eichler, H.J.; Lang, K.-D.; Glaw, V.; Kossatz, M.


Optical Society of America -OSA-, Washington/D.C.:
CLEO: Applications and Technology : Part of CLEO: 2018; 13-18 May 2018, San Jose, California, United States
Washington, DC: OSA, 2018
ISBN: 978-1-943580-42-2
Art. ATu4M.3
Conference on Lasers and Electro-Optics - Applications and Technology (CLEO A&T) <2018, San Jose/Calif.>
Fraunhofer IZM ()

Cu and Al particles were optimized to create thin films by laser direct transfer on Si-wafer substrate with minimal measured roughness; Cu-LIFT results are especially promising at high repetition rates and minimal pulse energy.