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W-band flip-chip VCO in thin-film environment

: Töpper, M.; Schmückle, F.J.; Lenk, F.; Hutter, M.; Klein, M.; Oppermann, H.; Engelmann, G.; Riepe, K.; Heinrich, W.


IEEE Microwave Theory and Techniques Society:
IEEE MTT-S International Microwave Symposium 2005. Vol.2 : June 12 - 17, 2005, Long Beach, CA
Piscataway, NJ: IEEE, 2005
ISBN: 0-7803-8845-3
International Microwave Symposium (IMS) <2005, Long Beach/Calif.>
Fraunhofer IZM ()

A flip-chip packaging approach for W-band GaAs chips is presented using thin-film structures on silicon as carrier substrate. Reliability investigations indicate that, depending on bump size, the CTE mismatch is not critical and an underfiller does not provide distinctive benefits. A 77 GHz VCO GaAs-HBT MMIC is flip-chip-mounted to demonstrate validity of the packaging scheme. Index Terms - Thin film circuit packaging, Flip-chip devices, MMIC oscillators.