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1996
Conference Paper
Titel
Alternative solder deposition using transfer technique
Abstract
Flip-chip mounting using soft solder offers several advantages in comparison with other chip-mounting technologies both in processing and performance and makes this technology very attractive especially for multichip modules (MCMs). FC devices lend their very good electrical performance to the short interconnects to make them suited for high speed applications. Highest I/O counts can be handled by introducing area array.