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Fabrication of high power MCMs by planar embedding technique and active cooling


Reichl, H.; Heuberger, A. ; MESAGO Messe Frankfurt GmbH, Stuttgart; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Micro System Technologies '96 : 5th International Conference on Micro Electro, Opto, Mechanical Systems and Components, Potsdam, September 17 - 19, 1996
Berlin: VDE-Verlag, 1996
ISBN: 3-8007-2200-3
International Conference on Micro-, Electro-, Opto-, Mechanical Systems and Components <5, 1996, Potsdam>
Fraunhofer IZM ()

This paper descibes the planar embedding technique for the fabrication of high power mulitchip modules (MCM-D). A back side planarizing process was developed which allowed a low thermal resistivity adhesive attachment of the MCM on high performance liquid cooled heat sinks. Dimensional tolerances of AIN substrates and heat sinks are investigated. Thermal simulation was used to demonstrate the advantages of the planar embedding technology compared to MCM's with die attach and wire bonding. Thermal test multichip modules of size "2x2" capable of a power dissipation above 1000W were assembled with different types of adhesives and heat sinks and the thermal performance quantified. Junction-to-ambient thermal resitivitites below 1.5Kcm²/W were achieved.