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Redistribution technology for chip scale package using photosensitive BCB

: Töpper, M.; Simon, J.; Reichl, H.

Future fab international (1996), Nr.2, S.363-368
ISSN: 1363-5182
Fraunhofer IZM ()

The advantages of flip chip technology with regard to electrical performance and reduced mounting area are well-known. Unfortunately most of the available dice are not designed for flip chip applications with an area arrangement of the bond pads. At least for the near future, it must be assumed that the majority of integrated circuits will be used in packages and therefore will have peripheral bondpads. If the die size is determinded by the peripheral, shrinking the size requires a reduction in pitch. A reduced pitch may limit use as a flip chip, hence Chip Scale Packages (CSPs) offer a solution of this problem.