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  4. Power Interconnect Trends - Cost Savings for PCB Power Electronics by Enabling Wear Out
 
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2018
Presentation
Title

Power Interconnect Trends - Cost Savings for PCB Power Electronics by Enabling Wear Out

Title Supplement
Presentation held at Schweizer Electronic Power and Radar PCB Summit 27./28.06.2018
Author(s)
Schletz, Andreas  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Conference
Electronic Power and Radar PCB Summit 2018  
File(s)
Download (1.43 MB)
Rights
Use according to copyright law
DOI
10.24406/publica-fhg-400984
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Keyword(s)
  • Power electronic

  • Automotive transmission control electronics

  • power seminconductors

  • sintering

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