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Novel chip embedding and interconnection technology for mm-wave System-in-Package (SiP) applications

: Landesberger, Christof; Drost,, A.; Faul, R.; Hell, W.; Scherbaum, S.; Bonfert, D.; Ott, A.; Hotopan, R.; Böhnke, R.

Otto, T. ; Messe Frankfurt; Fraunhofer-Institut für Elektronische Nanosysteme -ENAS-, Chemnitz; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Smart Systems Integration 2018. International Conference and Exhibition on Integration Issues of Miniaturized Systems : Dresden, Germany, 11 - 12 April 2018
Auerbach /Vogtl.: Verlag Wissenschaftliche Scripten, 2018
ISBN: 978-3-95735-082-4
ISBN: 3-95735-082-4
ISBN: 978-1-5108-6771-0 (Ausgabe bei Curran)
International Conference and Exhibition on Integration Issues of Miniaturized Systems <2018, Dresden>
Smart Systems Integration Conference (SSI) <2018, Dresden>
European Commission EC
H2020; 662175; WAYTOGO FAST
Bundesministerium für Bildung und Forschung BMBF
Fraunhofer EMFT ()

We will present first technological and electrical test results from a novel chip embedding technology for RF systems and mm-wave applications. Thinned dies are embedded in cavities of a silicon wafer whereby a planar wafer surface is retained. Subsequently, a two layer redistribution wiring scheme is prepared to enable quasi planar electrical interconnection of dies, impedance controlled transmission lines and integrated resonance antennas which are placed on top of the cavities. Electrical tests show low contact resistances for DC contacts and antenna characteristics show very good accordance of RF simulation results and electrical measurements.