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Advanced sensor systems by low-temperature heterogeneous 3D integration processes

: Fernandez-Bolanos, Montserrat; Muller, Andrei; Weber, Josef; Ramm, Peter

Postprint urn:nbn:de:0011-n-5032467 (6.3 MByte PDF)
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Erstellt am: 17.7.2018

Mailly, Frédérick; Marcelli, Romolo; Mita, Yoshio; Nouet, Pascal; Pressecq, Francis; Schneider, Peter; Smith, Steward ; Institute of Electrical and Electronics Engineers -IEEE-:
Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, DTIP 2018 : Roma, Italy, May 22nd - May 25th, 2018
Piscataway, NJ: IEEE, 2018
ISBN: 978-1-5386-6197-0
ISBN: 978-1-5386-6199-4
ISBN: 978-1-5386-6198-7
ISBN: 978-1-5386-6200-7
5 S.
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) <20, 2018, Roma>
European Commission EC
H2020; 685559; NEREID
NanoElectronics Roadmap for Europe: Identification and Dissemination
Konferenzbeitrag, Elektronische Publikation
Fraunhofer EMFT ()
3D integration; advanced sensor systems; heterogeneous integration; low-temperature bonding; Through Silicon Vias (TSV); Solid-Liquid Interdiffusion (SLID); FET-based sensors; CNT-based gas sensor; Heterogeneous 3D Integration

A few application demonstrators of heterogeneous 3D integrated systems including innovative nanosensors for gas detection and biofludic applications have been successfully implemented showing efficient low-temperature heterogeneous integration processes, miniaturization, low power consumption, extremely low detection limits (5 ppm) and novel functionalities very interesting for smart sensors in automotive and healthcare applications.