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Integration of a Ka-Band Front-End Components Using a Copper Core Printed Circuit Board

: Curran, B.; Reyes, J.; Tschoban, C.; Ndip, I.; Lang, K.-D.; Leiß, J.; Martinez-Vazquez, M.; Baggen, R.


American Institute of Aeronautics and Astronautics -AIAA-, Washington/D.C.:
35th AIAA International Communications Satellite Systems Conference, ICSSC 2017 : Trieste, Italy, 16-19 October 2017
Red Hook, NY: Curran, 2017
ISBN: 9781624105180
International Communications Satellite Systems Conference (ICSSC) <35, 2017, Trieste>
Fraunhofer IZM ()

Increasing demand for high bandwidth wireless satellite connections and telecommunications has resulted in interest in steerable antenna arrays in the GHz frequency range. These applications require cost-effective integration technologies for high frequency and high power integrated circuits (ICs) using GaAs, for example. In this paper, an integration platform is proposed, that enables GaAs ICs to be directly placed on a copper core inside cavities of a high frequency laminate for optimal cooling purposes. The platform is used to integrate a frequency doubler/amplifier and an I/Q Mixer to produce a -9 dBm RF output with approximately 20 dB second sideband isolation.