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Advanced packaging for wireless sensor nodes in cyber-physical systems - impacts of multifunctionality and miniaturization on the environment

: Wagner, E.; Böhme, C.; Benecke, S.; Nissen, N.N.; Lang, K.-D.


Institute of Electrical and Electronics Engineers -IEEE-:
IEEE International Conference on Prognostics and Health Management, ICPHM 2017 : June 19-21, 2017 in Dallas, TX, USA
Piscataway, NJ: IEEE, 2017
ISBN: 978-1-5090-5710-8
ISBN: 978-1-5090-5711-5
International Conference on Prognostics and Health Management (ICPHM) <2017, Dallas/Tex.>
Fraunhofer IZM ()

Advances in microsystem technology have led to an increasing trend of cyber physical system integration into industrial environments for prognostic health monitoring. Harsh environmental conditions require wireless sensor nodes (WSNs) that are robustness and reliable whilst meeting the requirements of miniaturization, functional integrity and energy efficiency at the same time. Moreover design and application of WSNs need to meet the target of an optimized trade-off between direct impacts associated with the life cycle of the electronics as well as indirect impacts triggered through the usage of electronics. In this contribution, functionally equivalent sensor designs are discussed that represent three evolutionary stages of electronics packaging. The most advanced sensor generation presented applies size-optimized routing, embedded active and passive devices and bare-die assembly. The results of a life-cycle based environmental assessment conducted for the three concepts of WSNs are presented. The study allows for the quantification and comparison of environmental impacts associated with the process of miniaturizing cyber physical system hardware by means of advanced packaging.