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Analysis of compensation effects in aluminum-implanted 4H-SiC devices

: Weisse, J.; Hauck, M.; Sledziewski, T.; Tschiesche, M.; Krieger, M.; Bauer, A.; Mitlehner, H.; Frey, L.; Erlbacher, T.


Stahlbush, R.:
Silicon Carbide and Related Materials 2017 : International Conference on Silicon Carbide and Related Materials, ICSCRM 2017, September 17-22, 2017, Washington, DC
Durnten-Zurich: TTP, 2018 (Materials Science Forum 924)
ISBN: 978-3-0357-1145-5
ISBN: 978-3-0357-2145-4
ISBN: 978-3-0357-3145-3
International Conference on Silicon Carbide and Related Materials (ICSCRM) <2017, Washington/DC>
Fraunhofer IISB ()
activation; admittance spectroscopy; aluminium implantation; compensation; hall effect; ionization energy; Secondary Ion Mass Spectrometry (SIMS)

In this work, we analyze compensating defects which are formed after implantation of aluminum (Al) into n-type 4H-SiC epitaxial layers and subsequent thermal annealing. These defects reduce the expected free charge carrier density by 84% for a low doped layer with [Al]impl ≈ 9·1016 cm-3 and by 27 % for a high doped layer with [Al]impl ≈ 2·1019 cm-3. Furthermore, an electrical activation ratio of implanted aluminum ions of 100 % is calculated. The ionization energy of implanted aluminum as measured by Hall effect and admittance spectroscopy ranges from 101 meV to 305 meV depending on the doping concentration.