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Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu technology


Coté, R.E. ; International Microelectronics and Packaging Society -IMAPS-; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
International Conference on High Density Packaging and MCMs 1999. Proceedings : April 6 - 9, 1999, The Adams's Mark Hotel, Denver, Colorado
Reston, Va.: IMAPS, 1999 (SPIE Proceedings Series 3830)
ISBN: 0-930815-57-2
International Conference on High Density Packaging and MCMs <1999, Denver/Colo.>
Fraunhofer IZM ()

The MCM-D which is described here is a prototype for a pixel detector system for the planned Large Hadron Collider LHC at CERN, Geneva. The project is within the ATLAS experiment. A module consists of a sensor tile with an active area of 16.4 mm x 60.4mm, 16 read out chips, each serving 24x160 pixel unit cells, a module controller chip, an optical transceiver and the local signal interconnection and power distribution busses. The extremely high wiring density which is necessary to interconnect the read-out chips was achieved using a thin film Copper/Photo-BCB process above the pixel array. The bumping of the read out chips was done using electroplating PbSn. All dies are then attached by flip-chip assembly to the sensor diodes and the local busses. Focus of this paper is the detailed description of the technologies for the fabrication of this advanced MCM-D.