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Characteristics of lead-free solders during flow soldering (selective and wave soldering)

: Pape, U.; Schulz, J.-U.


TU Dresden, Institut für Aufbau- und Verbindungstechnik der Elektronik -IAVT-; Institute of Electrical and Electronics Engineers -IEEE-:
1st Electronics Systemintegration Technology Conference, ESTC 2006. Vol.1 : Dresden, 5.-7.9.2006
New York, NY: IEEE, 2006
ISBN: 1-4244-0552-1
ISBN: 1-4244-0533-X
Electronics Systemintegration Technology Conference (ESTC) <1, 2006, Dresden>
Fraunhofer IZM ()
liquid solder; characteristic

The use of lead-free solders requires new fundamental information for flow soldering. Parameters, approved for many years with the solder SnPb, for wave height, flow speed and also the tear-off angle must be defined again for lead-free solders. In addition, the corrosion of substrate metallization and especially of machines (crucible and other parts in liquid solder) is under discussion for lead-free soldering today. A new combined measurement method for analyzing the characteristics of new solder in a relatively short time was developed at IZM. Therefore, the surface energy as a value for tear-off behavior, the viscosity as a value for the flow behavior and also the corrosion rate were measured. A comparison between different solders or solder alloys provides the solder manufacturers as well as the solder machine manufacturer with important data for the application and further development of new technologies.