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Strength characterization of directly bonded silicon

 
: Wiemer, M.; Fischer, C.; Bernasch, M.; Bagdahn, J.

Bagdahn, J. ; University of Technology of Delft:
2nd International Workshop on Wafer Bonding for MEMS Technologies 2006 : 9th-11th April 2006, Halle/Saale, Tagungsband
Halle/Saale, 2006
S.89-90
International Workshop on Wafer Bonding for MEMS Technologies <2, 2006, Halle/Saale>
Englisch
Konferenzbeitrag
Fraunhofer IWM ()
wafer bonding; strength; MEMS

Abstract
In this paper a test wafer for the characterization of the bond quality of directly bonded silicon is described. The 6`` test wafer contains samples for dicing yield, tensile strength and surface energy measurement. The test structures were etched at IZM, provided to different research and idustrial partners and directly bonded a low temperatures and subsequently characterized at the IWMH. The first results of the investigations are presented.

: http://publica.fraunhofer.de/dokumente/N-49287.html