Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Why use an assembly design kit and assembly design flow?

Blog-Beitrag auf https://semiengineering.com, 8. Februar 2018
 
: Heinig, Andy

:
Volltext (HTML; )

2018
Englisch
Elektronische Publikation
Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) ()

Abstract
Complex packages make it necessary to handle data in a machine-readable format:A number of years ago, the packages of electronic systems were only intended to protect the circuit from mechanical stresses and to realize a simple fan-out from the close spacing of connections on the circuit to the larger spacing on the packaging. At the time, there were also only a few different packaging types, all of simple design. Over the years, however, the requirements on packages have increased considerably, for instance due to the extreme growth in the number of connections to the circuit. These developments have led to the integration of complex systems for wiring management and fanning out the connections. This generally also includes a substrate that is now realized in the smallest achievable interconnect dimensions. The embedding of multiple circuits has also given rise to new packaging requirements. As a result, an entire spectrum of new and sometimes highly complex packages has been developed in recent years.

: http://publica.fraunhofer.de/dokumente/N-491721.html