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PCB-embedding for GaN-on-Si power devices and ICs

 
: Reiner, Richard; Weiss, Beatrix; Meder, Dirk; Waltereit, Patrick; Vockenberger, C.; Gerrer, Thomas; Quay, Rüdiger; Ambacher, Oliver

Verband Deutscher Elektrotechniker e.V. -VDE-, Berlin:
CIPS 2018, 10th International Conference on Integrated Power Electronics Systems : March, 20-22, 2018 Stuttgart/Germany
Berlin: VDE-Verlag, 2018 (ETG-Fachbericht 156)
ISBN: 978-3-8007-4540-1
S.440-445
International Conference on Integrated Power Electronics Systems (CIPS) <10, 2018, Stuttgart>
Englisch
Konferenzbeitrag
Fraunhofer IAF ()

Abstract
This paper investigates a printed circuit board (PCB)-embedding technology as packaging technology for 600 V class GaN-on-Si power devices and power integrated circuits (ICs). The electrical and thermal characteristics of PCB embedding are investigated and compared to conventional assemblies based on wire-bonding and soldering.

: http://publica.fraunhofer.de/dokumente/N-487971.html