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Solder joint fatigue analysis under combined thermal and vibration loading

 
: Meier, Karsten; Röllig, Mike; Liu, Y.; Bock, K.

:

Institute of Electrical and Electronics Engineers -IEEE-:
IEEE 19th Electronics Packaging Technology Conference, EPTC 2017 : 6-9 December 2017, Singapore
Piscataway, NJ: IEEE, 2018
ISBN: 978-1-5386-3042-6
ISBN: 978-1-5386-3041-9
ISBN: 978-1-5386-3043-3
5 S.
Electronics Packaging Technology Conference (EPTC) <19, 2017, Singapore>
Englisch
Konferenzbeitrag
Fraunhofer IKTS ()

Abstract
The following topics are dealt with: integrated circuit interconnections; integrated circuit reliability; three-dimensional integrated circuits; copper; integrated circuit packaging; silicon; wafer level packaging; electronics packaging; and solders.

: http://publica.fraunhofer.de/dokumente/N-487609.html