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Measurement methods to build up the digital optical twin

: Prochnau, M.; Holzbrink, M.; Wang, W.; Holters, M.; Stollenwerk, J.; Loosen, P.


Glebov, A.L. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Components and Packaging for Laser Systems IV : 30 January - 1 February 2018, San Francisco, California
Bellingham, WA: SPIE, 2018 (Proceedings of SPIE 10513)
ISBN: 978-1-5106-1511-3
ISBN: 978-1-5106-1512-0
Paper 105131I, 10 S.
Conference "Components and Packaging for Laser Systems" <4, 2018, San Francisco/Calif.>
Fraunhofer ILT ()

The realization of the Digital Optical Twin (DOT), which is in short the digital representation of the physical state of an optical system, is particularly useful in the context of an automated assembly process of optical systems. During the assembly process, the physical system status of the optical system is continuously measured and compared with the digital model. In case of deviations between physical state and the digital model, the latter one is adapted to match the physical state.
To reach the goal described above, in a first step measurement/characterization technologies concerning their suitability to generate a precise digital twin of an existing optical system have to be identified and evaluated. This paper gives an overview of possible characterization methods and, finally, shows first results of evaluated, compared methods (e.g. spot-radius, MTF, Zernike-polynomials), to create a DOT. The focus initially lies on the unequivocalness of the optimization results as well as on the computational time required for the optimization to reach the characterized system state. Possible sources of error are the measurement accuracy (to characterize the system) , execution time of the measurement, time needed to map the digital to the physical world (optimization step) as well as interface possibilities to integrate the measurement tool into an assembly cell. Moreover, it is to be discussed whether the used measurement methods are suitable for a ‘seamless’ integration into an assembly cell.