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Insertion loss study for panel-level single-mode glass waveguides

: Neitz, M.; Röder-Ali, J.; Marx, S.; Herbst, C.; Frey, C.; Schröder, H.; Lang, K.-D.


Schröder, H. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Optical Interconnects XVII : 30 January-1 February 2017, San Francisco, California, United States
Bellingham, WA: SPIE, 2017 (Proceedings of SPIE 10109)
ISBN: 978-1-5106-0659-3
ISBN: 978-1-5106-0660-9
Paper 101090J, 8 S.
Conference "Optical Interconnects" <17, 2017, San Francisco/Calif.>
European Commission EC
FP7-ICT; 318240; PhoxTroT
Photonics for High-Performance, Low-Cost & Low-Energy Data Centers, High Performance Computing Systems:Terabit/s Optical Interconnect Technologies for On-Board, Board-to-Board, Rack-to-Rack data links
Fraunhofer IZM ()

The paper compares the results of panel- and wafer-level processing of display glass integrated single mode optical waveguides. The comparison is based on measurements of the same optical structures processed using panel- and wafer-level technology. Additionally, large panels of 440 mm x 305 mm where manufactured to prove the scalability of the single-mode process. Measurements are done by optical back scattering reflectometry using a Luna OBR 4600 and a fiber-based propagation loss measurement setup. Based on these results of diverse processing equipment and substrate dimensions, a comprehensive statistic is shown and error estimation made to compare the different technologies.