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2017
Conference Paper
Titel
Improved bonding behavior by plasma coating for roughened surfaces
Titel Supplements
Abstract
Abstract
Direct bonding of glass and silicon wafers requires very low surface roughness. In many cases, substrates do not have a sufficient surface quality after polishing, or surface damages occurs from previous process steps. Experiments on roughened glass and silicon wafers suggest that silicon oxide layers with a high silanol concentration can be used to promote direct bonding for substrates having low surface quality. The layers were deposited from silane, SiH4, using atmospheric-pressure plasma-enhanced CVD.