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Improved bonding behavior by plasma coating for roughened surfaces

 
: Eichler, M.; Nagel, K.; Klages, C.-P.

Knechtel, Roy (Ed.) ; Interuniversity Micro-Electronics Center -IMEC-, Louvain:
WaferBond 2017, Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration. Book of Abstracts : 27th - 29th Novmber 2017, Leuven, Belgium
Leuven: IMEC, 2017
S.23-24
Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration (WaferBond) <2017, Leuven>
Englisch
Abstract
Fraunhofer IST ()

Abstract
Direct bonding of glass and silicon wafers requires very low surface roughness. In many cases, substrates do not have a sufficient surface quality after polishing, or surface damages occurs from previous process steps. Experiments on roughened glass and silicon wafers suggest that silicon oxide layers with a high silanol concentration can be used to promote direct bonding for substrates having low surface quality. The layers were deposited from silane, SiH₄, using atmospheric-pressure plasma-enhanced CVD.

: http://publica.fraunhofer.de/dokumente/N-477600.html