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DEIS: Dependability Engineering Innovation for Industrial CPS

 
: Armengaud, Eric; Macher, Georg; Massoner, Alexander; Frager, Sebastian; Adler, Rasmus; Schneider, Daniel; Longo, Simone; Melis, Massimiliano; Groppo, Riccardo; Villa, Federica; O'Leary, Padraig; Bambury, Kevin; Finnegan, Anita; Zeller, Marc; Höfig, Kai; Papadopoulos, Yiannis; Hawkins, Richard; Kelly, Tim

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Zachäus, Carolin:
Advanced Microsystems for Automotive Applications 2017 : Smart Systems Transforming the Automobile; held in Berlin on September 25 and 26, 2017, International Forum on Advanced Microsystems for Automotive Applications (AMAA)
Cham: Springer International Publishing, 2018 (Lecture notes in mobility)
ISBN: 978-3-319-66971-7 (Print)
ISBN: 978-3-319-66972-4 (Online)
S.151-163
International Forum on Advanced Microsystems for Automotive Applications (AMAA) <21, 2017, Berlin>
Englisch
Konferenzbeitrag
Fraunhofer IESE ()
safety; security; DEIS; cyber physical system; automotive application; rail; health care

Abstract
The open and cooperative nature of Cyber-Physical Systems (CPS) poses new challenges in assuring dependability. The DEIS project (Dependability Engineering Innovation for automotive CPS. This project has received funding from the European Union's Horizon 2020 research and innovation programme under grant agreement No 732242, see http://www.deis-project.eu addresses these challenges by developing technologies that form a science of dependable system integration. In the core of these technologies lies the concept of a Digital Dependability Identity (DDI) of a component or system. DDIs are modular, composable, and executable in the field facilitating (a) efficient synthesis of component and system dependability information over the supply chain and (b) effective evaluation of this information in-the-field for safe and secure composition of highly distributed and autonomous CPS. The paper outlines the DDI concept and opportunities for application in four industrial use cases.

: http://publica.fraunhofer.de/dokumente/N-474588.html