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Characterization of printed electronics

 
: Lee, Daniel

Stuttgarter Produktionsakademie:
Industry 4.0 - Cyber-Physical Systems : Seminar. 23th-27th October 2017, Stuttgart
Stuttgart, 2017 (Seminar SPA 396)
28 Folien
Seminar "Industry 4.0 - Cyber-Physical Systems" <2017, Stuttgart>
Englisch
Konferenzbeitrag
Fraunhofer IPA ()
Industrie 4.0; functional material; Cyber-Physisches System (CPS); printed electronics; Nanomaterial; dispersion

Abstract
The presentation includes several possibilities to characterize printed electronics.
In the field of production and research, it is important to know whether the quality of the layers remains unchanged and what kind of properties the layers or dispersions possess.
The presentation is structured in two sections "characterization of Dispersion" and "characterization of layer”.
The first section presents the characterization methods that the properties of the dispersions investigate (see below).
- Particle size and particle size distribution
- Rheology – Viscosity
- wetting behavior
- adhesion on the substrate
The second section presents the characterization methods that the properties of the applied layers describe (see below).
- Layer thickness - laser scanning microscope
- Adhesion
- Electrical characterization
- Two-terminal-sensing
- Four-terminal sensing
- Four-point-probes
Transparency - UV-VIS Spectrophotometer

: http://publica.fraunhofer.de/dokumente/N-473273.html