
Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Simulation-based design methodology for heterogeneous systems at package-level utilizing XML and XSLT
| Kraemer, R. ; Informationstechnische Gesellschaft -ITG-: Zuverlässigkeit und Entwurf. 9. ITG/GMM/GI-Fachtagung 2017 : 18.-20. September 2017, Cottbus Berlin: VDE-Verlag, 2017 (ITG-Fachbericht 274) ISBN: 978-3-8007-4444-2 ISBN: 3-8007-4444-9 S.66-73 |
| Fachtagung "Zuverlässigkeit und Entwurf" (ZuE) <9, 2017, Cottbus> |
| European Commission EC EFRE; MARS Ultra-Low-Power Technologien und 3D Integration |
|
| Englisch |
| Konferenzbeitrag |
| Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) () |
Abstract
System-in-Package is an appealing alternative compared to the integration on a PCB or in a chip. A big variety of different packaging solutions (including 2.5/3D integration) makes it difficult to choose the most appropriate solution for a given specification. Simulation-based design flows gain importance, but lack the straightforward access to actual design data. We propose a new description format as well as a corresponding methodology to manage and process assembly and packaging design data. Based on established software concepts (XML/XSLT), our Assembly Description Format (ADF) integrates well into existing design environments and features a high flexibility to consider distinct design aspects.