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Simulation-based design methodology for heterogeneous systems at package-level utilizing XML and XSLT

 
: Fischbach, Robert; Heinig, Andy; Lienig, Jens

Kraemer, R. ; Informationstechnische Gesellschaft -ITG-:
Zuverlässigkeit und Entwurf. 9. ITG/GMM/GI-Fachtagung 2017 : 18.-20. September 2017, Cottbus
Berlin: VDE-Verlag, 2017 (ITG-Fachbericht 274)
ISBN: 978-3-8007-4444-2
ISBN: 3-8007-4444-9
S.66-73
Fachtagung "Zuverlässigkeit und Entwurf" (ZuE) <9, 2017, Cottbus>
European Commission EC
EFRE; MARS
Ultra-Low-Power Technologien und 3D Integration
Englisch
Konferenzbeitrag
Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) ()

Abstract
System-in-Package is an appealing alternative compared to the integration on a PCB or in a chip. A big variety of different packaging solutions (including 2.5/3D integration) makes it difficult to choose the most appropriate solution for a given specification. Simulation-based design flows gain importance, but lack the straightforward access to actual design data. We propose a new description format as well as a corresponding methodology to manage and process assembly and packaging design data. Based on established software concepts (XML/XSLT), our Assembly Description Format (ADF) integrates well into existing design environments and features a high flexibility to consider distinct design aspects.

: http://publica.fraunhofer.de/dokumente/N-470364.html