Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors
| Institute of Electrical and Electronics Engineers -IEEE-; Components, Packaging and Manufacturing Technology Society -CPMT-, Japan Chapter:
5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Proceedings : May 16-18, 2017, Ito International Research Center, The University of Tokyo, Tokyo, Japan
Piscataway, NJ: IEEE, 2017
ISBN: 978-1-5386-1598-0
ISBN: 978-4-904743-03-4
ISBN: 978-4-904743-05-8
S.13 |
| International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) <5, 2017, Tokyo> |
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| Englisch |
| Konferenzbeitrag |
| Fraunhofer ENAS () |
Abstract
Summary form only given. This paper describes approaches for 3D integration of CMOS and MEMS sensors. It implies methods for wafer level packaging, Through-Silicon-Vias (TSV) and novel methods for heterogeneous system integration like micro-transfer-printing. These technologies are described on sensor devices.