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Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors

 
: Dempwolf, Sophia; Hofmann, L.; Bowers, Christopher; Guenther, Daniela; Knechtel, Roy; Schulz, S.E.; Gerbach, Ronny

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Institute of Electrical and Electronics Engineers -IEEE-; Components, Packaging and Manufacturing Technology Society -CPMT-, Japan Chapter:
5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Proceedings : May 16-18, 2017, Ito International Research Center, The University of Tokyo, Tokyo, Japan
Piscataway, NJ: IEEE, 2017
ISBN: 978-1-5386-1598-0
ISBN: 978-4-904743-03-4
ISBN: 978-4-904743-05-8
S.13
International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) <5, 2017, Tokyo>
Englisch
Konferenzbeitrag
Fraunhofer ENAS ()

Abstract
Summary form only given. This paper describes approaches for 3D integration of CMOS and MEMS sensors. It implies methods for wafer level packaging, Through-Silicon-Vias (TSV) and novel methods for heterogeneous system integration like micro-transfer-printing. These technologies are described on sensor devices.

: http://publica.fraunhofer.de/dokumente/N-467696.html