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2017
Conference Paper
Titel
Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors
Abstract
Summary form only given. This paper describes approaches for 3D integration of CMOS and MEMS sensors. It implies methods for wafer level packaging, Through-Silicon-Vias (TSV) and novel methods for heterogeneous system integration like micro-transfer-printing. These technologies are described on sensor devices.
Author(s)