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2016
Conference Paper
Titel
Contactless fault isolation for FinFET technologies with visible light and GaP SIL
Abstract
The visible approach of optical Contactless Fault Isolation (VIS-CFI) serves the perspective of application in FinFET technologies of 10 nm nodes and smaller. A solid immersion lens (Sir.) is mandatory to obtain a proper resolution. A VIS-CFI setup with SIL requires a global polishing process for sub 10 gm silicon thickness. This work is the first to combine all these necessary components for high resolving VIS-CFI in one successful experiment. We demonstrate Laser Voltage Imaging and Probing (LVI, LVP) on 16/14 nm technology devices and investigate a focus depth dependence of the LVI/LVP measurement in FinFhTs.