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Contactless fault isolation for FinFET technologies with visible light and GaP SIL

 
: Lohrke, H.; Scholz, P.; Beyreuther, A.; Ganesh, U.; Uhlmann, E.; Kuhne, S.; Jagodzinski, M.; Iwaki, Y.; Chivas, R.; Silverman, S.; Boit, C.

ASM International; Electronic Device Failure Analysis Society -EDFAS-, Materials Park/Ohio:
ISTFA 2016, 42nd International Symposium for Testing and Failure Analysis. Conference Proceedings : November 6-10, 2016, Fort Worth Convention Center, Fort Worth, Texas, USA
Materials Park, Ohio: ASM International, 2016
ISBN: 978-1-62708-135-1
ISBN: 978-1-62708-136-8
ISBN: 1-62708-135-6
S.19-26
International Symposium for Testing and Failure Analysis (ISTFA) <42, 2016, Fort Worth/Tex.>
Englisch
Konferenzbeitrag
Fraunhofer IPK ()

Abstract
The visible approach of optical Contactless Fault Isolation (VIS-CFI) serves the perspective of application in FinFET technologies of 10 nm nodes and smaller. A solid immersion lens (Sir.) is mandatory to obtain a proper resolution. A VIS-CFI setup with SIL requires a global polishing process for sub 10 gm silicon thickness. This work is the first to combine all these necessary components for high resolving VIS-CFI in one successful experiment. We demonstrate Laser Voltage Imaging and Probing (LVI, LVP) on 16/14 nm technology devices and investigate a focus depth dependence of the LVI/LVP measurement in FinFhTs.

: http://publica.fraunhofer.de/dokumente/N-467521.html