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2017
Conference Paper
Titel
Accelerated SLID bonding for fine-pitch interconnects with porous microstructure
Abstract
Solid-liquid interdiffusion (SLID) inter connects based on Cu and Sn-solder are excellent candidates for stacking of Si chips in 3D integration. If the high-temperature stable intermetallic compound (IMC) Cu3Sn is desired, the manufacturing of the interconnect can be very time consuming(long annealing time for growth of Cu3Sn). In this paper wepropose a method for the accelerated formation of Cu-Cu3Sn-Cu interconnects by selective dissolution of Sn from Cu6Sn5. This leads to a porous network of Cu3Sn. The influence of temperature, flux and atmosphere onto the pore formation will be addressed in detail.