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Fabrication of application specific integrated passive devices using wafer level packaging technologies

: Zoschke, K.; Wolf, J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Scherpinski, K.; Reichl, H.; Schmückle, F.-J.

Electronic Components, Assemblies, and Materials Association; Electronic Industries Alliance -EIA-; IEEE Components, Packaging, and Manufacturing Technology Society:
55th Electronic Components & Technology Conference 2005. Proceedings. Vol.2 : Lake Buena Vista, FL, USA, May 31 - June 4, 2005
Piscataway, NJ: IEEE Service Center, 2005
ISBN: 0-7803-8906-9
ISBN: 0-7803-8907-7
Electronic Components and Technology Conference (ECTC) <55, 2005, Lake Buena Vista/Fla..>
Fraunhofer IZM ()

Integrated passives have become increasingly popular in the last years. Especially wafer level packaging technologies offer an interesting variety of different possibilities for the implementation of integrated passive components. In this context particularly the fabrication of integrated passive devices (IPDs) represents a promising solution regarding the reduction of size and assembly costs of electronic systems in package (SiP). These IPDs combine different passive components (R, L, C) in one subcomponent to be assembled in one step by standard technologies like SMD or flip chip. In this paper the wafer level thin film fabrication of such IPDs (WL-IPDs) will be discussed. After a brief overview of the different possibilities for the realization of IPDs using wafer level packaging technologies two fabricated WL-IPDs will be presented. Design, technological realization as well as results from the electrical characterization will be discussed.