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Passive alignment flip chip assembly using surface tension of liquid solder and micromechanical stops

 
: Oppermann, H.; Hutter, M.; Engelmann, G.; Reichl, H.

Tanner, D.M. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.; Semiconductor Equipment and Materials International -SEMI-, San Jose/Calif.:
Reliability, packaging, testing, and characterization of MEMS/MOEMS IV : 24 - 25 January 2005, San Jose, California, USA
Bellingham/Wash.: SPIE, 2005 (SPIE Proceedings Series 5716)
ISBN: 0-8194-5690-X
S.19-25
Conference "Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS" <4, 2005, San Jose/Calif.>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

: http://publica.fraunhofer.de/dokumente/N-45654.html