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Enhanced contamination control methods in advanced wafer processing

: Pfeffer, M.; Richter, H.; Altmann, R.; Leibold, A.; Bauer, A.


Saito, S. ; Institute of Electrical and Electronics Engineers -IEEE-:
International Symposium on Semiconductor Manufacturing, ISSM 2016. Proceedings of technical papers : December 12-13, 2016, KFC Hall, Tokyo, Japan
Piscataway, NJ: IEEE, 2017
ISBN: 978-1-5090-4511-2
ISBN: 978-1-5090-4512-9
5 S.
International Symposium on Semiconductor Manufacturing (ISSM) <24, 2016, Tokyo>
European Commission EC
FP7-ICT; 611332; SEA4KET
Semiconductor Equipment Assessment for Key Enabling Technologies
Fraunhofer IISB ()

Semiconductor manufacturing is a highly complex process, with a high need for process control, but equally important are effective methods for contamination control. Methods for detection of airborne and surface molecular contaminants were enhanced to meet the increasing requirements for future More Moore and More than Moore applications. Improved qualitative and quantitative contamination analysis methods of organic and inorganic compounds allow exact monitoring of contamination in front- as well as back-end processes. By the use of state-of-the-art analytical systems combined with validated analytical procedures and advanced sample preparation techniques contamination analytical results with higher reproducibility and reliability are being ensured.