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Canary devices for through-silicon vias a condition monitoring approach

: Jerchel, K.; Grams, A.; Nissen, N.F.; Suga, T.; Lang, K.-D.


Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
International Conference on Electronics Packaging, ICEP 2017 : Takinoyu Hotel, Tendo, Yamagata, Japan, April 19 (Wed.)-22 (Sat.), 2017
Piscataway, NJ: IEEE, 2017
ISBN: 978-4-9902188-3-6
ISBN: 978-4-9902188-2-9
ISBN: 978-1-5090-4888-5 (Print)
International Conference on Electronics Packaging (ICEP) <2017, Tendo/Japan>
Fraunhofer IZM ()

A methodology for the design of canary devices intended for condition monitoring is described in detail for through-silicon vias (TSVs). Two different canaries a geometry change canary and a load-exposure change canary are proposed. To evaluate the proposed canary design qualitatively a comparative finite element study was conducted.