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Swift and accurate - Investigation of remote laser cutting for open cell foams

Presentation at Lasers in Manufacturing Conference, LiM 2017
 
: Baumann, Robert; Herwig, Patrick; Wetzig, Andreas; Beyer, Eckhard

:
Volltext urn:nbn:de:0011-n-4535232 (860 KByte PDF)
MD5 Fingerprint: b1416c50dda41e34aea6ff56bafd0e21
Erstellt am: 19.07.2018


Wissenschaftliche Gesellschaft Lasertechnik -WLT-:
International Conference on Lasers in Manufacturing, LiM 2017 : Munich ICM, Internationales Congress Center München, Germany, June 26-29, 2017, CD-ROM
München: Wissenschaftliche Gesellschaft Lasertechnik e.V., 2017
Paper 2, 10 S.
International Conference on Lasers in Manufacturing (LiM) <2017, Munich>
World of Photonics Congress <2017, Munich>
Bundesministerium für Bildung und Forschung BMBF
Werkstoffinnovationen für Industrie und Gesellschaft - WING; 03X4637A-H; BamoSa
Batterie - mobil in Sachsen
Englisch
Konferenzbeitrag, Elektronische Publikation
Fraunhofer IWS ()
cutting; Laser; accuracy; metal foam; Inconel

Abstract
It is well known that the global climate change is the largest challenge for the society of the 21th century. For managing the resulting consequences, innovative materials become more and more important for energy efficient applications. Open cell metal foam contributes promising solutions to the light weight design, battery applications and renewable energy harvesting. Still, challenges are present concerning the cutting into a defined shape. The remote laser cutting offers a solution for decreasing the production costs as well as the needed component accuracy. Our investigations consider that this technique has a high potential concerning cutting speed, which was increased more than 500% compared to state of the art laser separation. Next to that, the contour accuracy was improved as well, resulting in tolerances with less than 60 μm. This paper offers insight into the viability of remote laser cutting in overcoming the challenges dealing with mechanical milling or grinding. Investigating the process concerning thermal stress input as well as particle attachments will be the next steps in the future.

: http://publica.fraunhofer.de/dokumente/N-453523.html