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Experimental determination of the Young's modulus of various electronic packaging materials

 
: Krämer, Frank; Röllig, Mike; Metasch, René; Wiese, Steffen; Al Ahmar, Joseph; Meier, Karsten

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Institute of Electrical and Electronics Engineers -IEEE-; Fraunhofer-Institut für Keramische Technologien und Systeme -IKTS-, Dresden:
18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 : 3-5 April 2017, Dresden
Piscataway, NJ: IEEE, 2017
ISBN: 978-1-5090-4344-6
ISBN: 978-1-5090-4343-9
ISBN: 978-1-5090-4345-3
S.163-168
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <18, 2017, Dresden>
Englisch
Konferenzbeitrag
Fraunhofer IKTS ()
creep; elastic moduli; electronics packaging

Abstract
The paper presents details about the adequate experimental determination of the Young's modulus on miniaturized specimens for material used in electronic packaging. The difficulty to determine accurately the Young's modulus is caused by the requirements of representative specimens for the area of electronic packaging. In many cases such specimens, e.g. solder balls, are connected with the issues of inhomogeneous stress distributions, small dimensions, or special gripping requirements, that create a number of challenges to conduct mechanical experiments. In addition there are problems that arise from the nonlinearities in the constitutive behaviour of the material to be characterized, such as creep deformation. Therefore any attempt to accurately determine the Young's modulus needs a case to case consideration of the specific issues for the given specimen and material.

: http://publica.fraunhofer.de/dokumente/N-452674.html