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A novel approach for RF/microwave modeling and optimization of BGA packages

 
: Ndip, I.; John, W.; Reichl, H.; Thiede, A.

:

Ecole Polytechnique Federale de Lausanne -EPFL-; IEEE Circuits and Systems Society:
2005 PhD research in microelectronics and electronics. PRIME, proceedings of the conference. Vol.2 : Lausanne, Switzerland, July 25 - 28, 2005
Piscataway, NJ: IEEE Operations Center, 2005
ISBN: 0-7803-9345-7
S.233-236
Conference PhD Research in Microelectronics and Electronics (PRIME) <1, 2005, Lausanne>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

Abstract
A novel approach for RF/microwave modeling and optimization of ball grid array (BGA) packages is presented. Using the proposed methodology, wideband models that account for the parasitic contribution of all package components along complete signal paths (chip-to-board) were developed and validated. With the aid of these models, root causes of potential signal integrity (SI) problems were studied. Based on the results obtained, novel design measures were derived.

: http://publica.fraunhofer.de/dokumente/N-45017.html