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Title
VERFAHREN UND VORRICHTUNG ZUR OBERFLAECHENBEHANDLUNG ELEKTRISCH ISOLIERENDER SUBSTRATE
Date Issued
2003
Author(s)
Klages, C.
Jung, T.
Patent No
2000-10054197
Abstract
WO 200236851 A UPAB: 20020919 NOVELTY - To process the surface(s) of at least one electrically insulating substrate (2), using a corona discharge, two surface areas of one or more substrates are connected to a voltage supply (9). A voltage is delivered to zones of the surfaces of the same polarity, and a corona discharge is formed on the opposite sides of the defined zones. DETAILED DESCRIPTION - To process the surface(s) of at least one electrically insulating substrate (2), using a hollow cathode corona discharge or a corona discharge at the transition zone between a normal and a hollow cathode corona discharge, two surface areas of one or more substrates are connected to a voltage supply (9) with a capacitative coupling. A voltage is delivered to zones of the surfaces being treated of the same polarity, and a corona discharge is formed on the opposite sides of the defined zones. The voltage delivered to the surface zone(s) has the same or virtually identical potential. The two surfaces being processed are parallel to each other with a small gap between them of 1 mm to 50 cm. The substrate surface to be treated is exposed to coating electrodes, where the material is a strip which is moved past an electrode (1,1') in contact with it or with a small gap (7,7') between them. One or more substrates are moved in zones through the defined discharge stage. At least one substrate is moved around a deflection so that one surface is treated before the deflection point and the other surface is exposed after the deflection. The gas pressure at the discharge stage, between the two substrate surfaces, is 0.01-100.0 mbar using a gas wholly or partially of a noble gas and preferably argon. One or more reactive gases is fed between the substrate surfaces as an oxidation, reduction gas with carbon or silicon compounds using oxygen, hydrogen, nitrogen, methane, acetylene, silane, hexamethyldisoloxane and/or tetramethylsilane. The voltage has a frequency of 10kHz to 10 GHz, or 1-100 MHz . The voltage frequency is selected where the impedance of the substrate and, if required, the gap between the electrodes and the substrate, is lower than the impedance of the plasma of the gas discharge. The voltage is 1-3000 V. An INDEPENDENT CLAIM is also included for an assembly to treat the surface(s) of an electrically insulating substrate with a vacuum chamber, linked to a vacuum pump. It has a system to hold and/or guide the substrate at the vacuum chamber so that a discharge zone is defined for two spaced substrate surfaces. A gas is fed into the discharge zone so that there is a capacitive transfer of energy on to the surface(s) of at least one substrate. USE - The system, to treat the surface(s) of an electrically insulation substrate e.g. a polymer film, is for coating, cleaning, material removal and/or activating the substrate surface(s) or to integrate gas components in a substrate or at its surface layer. It can be used to deposit a protective layer against mechanical, electromagnetic and/or chemical effects, as a permeation barrier, an adhesive layer, a decorative layer and/or an optical functional layer. ADVANTAGE - The method gives a high deposition rate on to the substrate surface(s) in a coating action which also prevents parasite deposits.
Language
de
Patenprio
DE 2000-10054197 A: 20001102