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Title
VERFAHREN UND VORRICHTUNG ZUM TESTEN ODER KALIBRIEREN EINES DRUCKSENSORS AN EINEM WAFER
Date Issued
2004
Author(s)
Köster, Oliver
Slotkowski, Johann
Patent No
2001-10128235
Abstract
WO2002101348 A UPAB: 20030214 NOVELTY - A hollow space (38) occurs if needles (40) in a needle card (30) on contact surfaces of a pressure sensor contact the surface (20) of a wafer through a corresponding 3D structure in the needle card and the wafer or it surface. On the bottom side (44) of the needle card there is a soft silicon sealing lip (36) having its outer edge (48) connection with a pressure seal to the bottom side by gluing. DETAILED DESCRIPTION - On the surface of the wafer there are numerous pressure sensors in a grid each with a pressure-sensitive section, an electromechanical transformer and a signal output. INDEPENDENT CLAIMS are also included for the following: (1) a method for producing a pressure sensor component; (2) a device for applying a predefined pressure on a pressure sensor for multiple pressure sensors in a wafer and for picking up a signal from the pressure sensor's signal output. USE - For contacting and testing integrated circuits. ADVANTAGE - The pressure sensors can still be tested or calibrated on a non-detached wafer. This can be done at the same time as a test on the electrical properties of an integrated circuit and their operability.
Language
de
Patenprio
DE 2001-10128235 A: 20010611