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Assembly processes comparison for a miniaturized laser used for the Exomars European Space Agency mission

: Ribes-Pleguezuelo, P.; Inza, A.M.; Basset, M.G.; Rodriguez, P.; Rodriguez, G.; Laudisio, M.; Galan, M.; Hornaff, M.; Beckert, E.; Eberhardt, R.; Tünnermann, A.


Optical engineering 55 (2016), Nr.11, Paper 116107
ISSN: 0091-3286
ISSN: 0036-1860
ISSN: 1560-2303
Fraunhofer IOF ()

A miniaturized diode-pumped solid-state laser (DPSSL) designed as part of the Raman laser spectrometer (RLS) instrument for the European Space Agency (ESA) Exomars mission 2020 is assembled and tested for the mission purpose and requirements. Two different processes were tried for the laser assembling: one based on adhesives, following traditional laser manufacturing processes; another based on a low-stress and organic-free soldering technique called solderjet bumping technology. The manufactured devices were tested for the processes validation by passing mechanical, thermal cycles, radiation, and optical functional tests. The comparison analysis showed a device improvement in terms of reliability of the optical performances from the soldered to the assembled by adhesive-based means.