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Process optimization of laser-based solderjet bumping for the mounting of optical components

: Burkhardt, T.; Hornaff, M.; Kamm, A.; Burkhardt, D.; Beckert, E.; Eberhardt, R.; Tünnermann, A.


Navarro, R. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Advances in Optical and Mechanical Technologies for Telescopes and Instrumentation II : 26 June-1 July 2016, Edinburgh, United Kingdom
Bellingham, WA: SPIE, 2016 (Proceedings of SPIE 9912)
ISBN: 978-1-5106-0203-8
ISBN: 978-1-5106-0204-5
Paper 99123X, 13 S.
Conference "Advances in Optical and Mechanical Technologies for Telescopes and Instrumentation" <2, 2016, Edinburgh>
Fraunhofer IOF ()

Advanced optical systems of telescopes and scientific instrumentation require high accuracy mounting and joining of components. Applications for deep UV, under high energetic radiation, for vacuum operation, or assemblies subjected to environmental loads (e.g. humidity and temperature) require a replacement of organic adhesives or optical cement by a more robust bonding agent. Soldering allows the bonding of different materials with an inorganic filler material. We present the optimization of the laser-based Solderjet Bumping for the mounting of optical components and the parameters of the bonding process for fused silica and LAK9G15 (radiation resistant glass) with thermally matched metal mounts. The investigation covers the experimental determination and optimization of solder wetting to the respective base materials and the bond strengths achieved.