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2016
Journal Article
Titel
Identification and classification of contaminations on wafers using hyperspectral imaging
Abstract
We present a new characterization technique based on hyperspectral imaging applied to silicon wafers. It combines the measurement of spatially and spectrally resolved reflection features and a dedicated subsequent data analysis. This method allows for a rapid localization and classification of defects and contaminations on wafers. Thus, it complements standard imaging techniques such as infrared or luminescence imaging. In our work, we show that hyperspectral imaging is capable of separating clean and contaminated regions including a classification of the contamination type and a quantification of the coverage.