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Reliability in MID - barriers, potentials, fields of action

: Fechtelpeter, C.; Jürgenhake, C.; Mager, T.; Dumitrescu, R.; Fritz, K.-P.; Grözinger, T.; Wild, P.; Müller, H.; Zimmermann, A.


Franke, J. ; Institute of Electrical and Electronics Engineers -IEEE-:
12th International Congress Molded Interconnect Devices, MID 2016. Scientific proceedings : September 28th-29th, 2016, Würzburg, Germany
Piscataway, NJ: IEEE, 2016
ISBN: 978-1-5090-5428-2
ISBN: 978-1-5090-5426-8
ISBN: 978-1-5090-5427-5
ISBN: 978-1-5090-5429-9
International Congress Molded Interconnect Devices (MID) <12, 2016, Würzburg>
Fraunhofer IEM ()

The MID technology is used in more and more industrial applications. There are strong interactions between the materials used and the manufacturing process, which can have a direct influence of the quality and reliability of the final product. Hence, a comprehensive product and process qualification is necessary, because the available guidelines and directives are not sufficient to fulfill the specific requirements around MID.