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Direct laser interference patterning of transparent and colored polymer substrates: Ablation, swelling and the development of a simulation model

: Alamri, Sabri; Lasagni, Andrés-Fabián

Volltext urn:nbn:de:0011-n-4422871 (3.9 MByte PDF)
MD5 Fingerprint: 7853a28424000209666cd3ed2389c5f4
Erstellt am: 11.5.2017

Klotzbach, U. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Laser-based Micro- and Nanoprocessing XI : San Francisco, California, United States, 31 January - 2 February 2017
Bellingham, WA: SPIE, 2017 (Proceedings of SPIE 10092)
Paper 1009219, 10 S.
Conference "Laser-Based Micro- and Nanoprocessing" <11, 2017, San Francisco/Calif.>
European Commission EC
H2020; 675063; Laser4FUN
Konferenzbeitrag, Elektronische Publikation
Fraunhofer IWS ()
lasers; polymers; simulations; radiation; chemicals; data analysis; laser processing

It is well known that micro and sub-micrometer periodical structures play a significant role on the properties of a surface. Ranging from friction reduction to the bacterial adhesion control, the modification of the material surface is the key for improving the performance of a device or even creating a completely new function. Among different laser processing techniques, Direct Laser Interference Patterning (DLIP) relies on the local surface modification process induced when two or more beams interfere and produce periodic surface structures. Although the produced features have controllable pitch and geometry, identical experimental conditions applied to different polymers can result on totally different topologies. In this frame, observations from pigmented and transparent polycarbonate treated with ultraviolet (263 nm) and infrared (1053 nm) laser radiation permitted to identify different phenomena related with the optical and chemical properties of the polymers. As a result from the experimental data analysis, a set of material-dependent constants can be obtained and both profile and surface simulations can be retrieved, reproducing the material surface topography after the surface patterning process.