Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

The European 3D Heterogeneous Integration Platform (e-BRAINS) - A particular focus on reliability and low-temperature processes for 3D Integrated Sensor Systems

 
: Ramm, P.; Klumpp, A.; Weber, J.; Mathewson, A.; Razeeb, K.M.; Pufall, R.

International Microelectronics and Packaging Society:
11th International Conference and Exhibition on Device Packaging 2015 : Fountain Hills, Arizona, USA, 16 - 19 March 2015
Red Hook, NY: Curran, 2015
ISBN: 978-1-5108-0455-5
S.235-238
International Conference and Exhibition on Device Packaging (DPC) <11, 2015, Fountain Hills/Ariz.>
Englisch
Konferenzbeitrag
Fraunhofer EMFT ()

: http://publica.fraunhofer.de/dokumente/N-442224.html