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The European 3D Heterogeneous Integration Platform (e-BRAINS) - A particular focus on reliability and low-temperature processes for 3D Integrated Sensor Systems
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2015
Conference Paper
Titel
The European 3D Heterogeneous Integration Platform (e-BRAINS) - A particular focus on reliability and low-temperature processes for 3D Integrated Sensor Systems
Author(s)
Ramm, P.
Klumpp, A.
Weber, J.
Mathewson, A.
Razeeb, K.M.
Pufall, R.
Hauptwerk
11th International Conference and Exhibition on Device Packaging 2015
Konferenz
International Conference and Exhibition on Device Packaging (DPC) 2015
Language
English
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Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT